Changes between Version 1 and Version 2 of Internal/USBNoise/WiBo


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Timestamp:
Jun 23, 2006, 5:16:22 PM (18 years ago)
Author:
seskar
Comment:

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  • Internal/USBNoise/WiBo

    v1 v2  
    1111For orientation purposes, reference marks are shown along the top (A-D) and right sides (1-4) of the board in one inch increments.
    1212
    13 Looking from the top down with X-ray eyes,  the top copper layer is the component side with all the high-frequency RF transmission lines.  The dielectric under this layer is 20 mils thick. The structure of the traces is coplanar waveguide with ground (CPWG). 
     13Looking from the top down,  the top copper layer is the component side with all the high-frequency RF transmission lines.  The dielectric under this layer is 20 mils thick. The structure of the traces is coplanar waveguide with ground (CPWG). 
    1414A trace width of 30 mils and gap-to-ground of 18 mils provides a very close match to a 50ohm characteristic impedance. 
    1515
    1616The next copper layer down is all ground plane.  The third layer down is a signal layer with predominately vertical traces surrounded by ground plane.  The fourth or bottom layer is another signal layer with predominately horizontal traces.
    17 
     17[[Image(WiBo:WiBo-lowres.jpg )]]
    1818B.  Connector J3_F and I/O
    1919