| 6 | | TO DO |
| | 6 | The CM connector is a standard 3x2 0.100" header. It is located on the back of the phone above the rear camera lens. Pin 1 is in the upper left corner. Refer to Table 1 for connector pinout. |
| | 7 | |
| | 8 | || Pin || Function || |
| | 9 | || 1 || Power - ground || |
| | 10 | || 2 || Power - signal || |
| | 11 | || 3 || Volume Up - signal || |
| | 12 | || 4 || Volume Up - signal || |
| | 13 | || 5 || Volume Down - ground || |
| | 14 | || 6 || Volume Down - signal || |
| | 15 | Table 1: CM Connector Pinout |
| | 16 | |
| | 17 | [[BR]] |
| | 18 | [[Image(phone - complete diagram.jpg,title="Figure 1", 200)]] |
| | 19 | [[BR]]Figure 1: CM Connector |
| | 20 | |
| | 21 | == Chassis Manager (CM) Compatibility Modification == |
| | 22 | NOTE: All steps assume a device orientation where the "top" is the edge of the phone with the headphone jack, and the "bottom" is the edge with the USB and HDMI ports. |
| | 23 | |
| | 24 | [[BR]]'''Phone Disassembly:''' |
| | 25 | 1. Pry off back cover starting at the top. |
| | 26 | 2. Remove battery. |
| | 27 | 3. Unlock and remove SD Card. |
| | 28 | 4. Remove 6x T-5 Torx screws. |
| | 29 | 5. Separate the front and back of the phone by prying them apart along the edge (the black border around the red is part of the back half). |
| | 30 | |
| | 31 | [[BR]]'''Adding CM Connector:''' |
| | 32 | 1. Remove 1x Phillips screw in the top left of the PCB (by headphone jack). |
| | 33 | 2. Gently lift the PCB from the right side using the cables on the left as a "hinge" until the PCB is at 90 degrees to the screen. |
| | 34 | 3. Locate the power button on the under side of the PCB. It is at the top nearest the notch in the PCB (see Figure 2). |
| | 35 | 4. Solder 2 wires to the power button pads nearest the notch in the PCB. Looking at the power button, the top-right pad is ground, the bottom-right pad is the signal. |
| | 36 | 5. Place the PCB back down against the screen and reattach the screw removed in step 1. |
| | 37 | 6. Locate the Volume Up button on the right edge of the PCB (see Figure 2). It is just above the orange ribbon cable. |
| | 38 | 7. Solder 2 wires to the top 2 pads. The top-left pad is ground, the top-right pad is the signal. |
| | 39 | 8. Locate the Volume Down button on the right edge of the PCB (see Figure 2). It is just below the orange ribbon cable. |
| | 40 | 9. Solder 2 wires to the top 2 pads. The top-left pad is ground, the top-right pad is the signal. |
| | 41 | 10. Route all wires to the area just above the rear camera (use hot glue or tape as needed). |
| | 42 | 11. Solder the wires to a 3x2 0.100" header as described in the Table 1 CM Connector Pinout. |
| | 43 | 12. Hot glue the CM Connector to the PCB. |
| | 44 | 13. Cut/drill a hole in the red half of the phone as in Figure 3. |
| | 45 | 14. Looking at the underside of the read half: |
| | 46 | a. Discard the black rubber gasket around the speaker on the red half of the phone (see Figure 4). |
| | 47 | b. Cut off the 0.5cm tab at the bottom of the top-right screw hole. |
| | 48 | 15. Cut/drill a hole in the black back cover of the phone as in Figure 3. |
| | 49 | 16. Reassemble the phone by following the reverse of the disassembly steps above. |
| | 50 | |
| | 51 | |
| | 52 | || [[Image(phone - pcb diagram.jpg,title="Figure 2", 200)]] || [[Image(phone - all parts diagram.jpg,title="Figure 3", 400)]] || [[Image(phone - gasket.JPG,title="Figure 4", 200)]] || |
| | 53 | || Figure 2 || Figure 3 || Figure 4 || |
| | 54 | [[BR]] |
| | 55 | |
| | 56 | '''Testing CM Connector:''' |
| | 57 | 1. Short pins 1-2 momentarily, the phone should start booting up. |
| | 58 | 2. Once the phone boots up, unlock it to the home screen. |
| | 59 | 3. Short ping 3-4 momentarily, the screen should indicate volume being increased. |
| | 60 | 4. Short pins 5-6 momentarily, the screen should indicate volume being decreased. |
| | 61 | 5. As a final step, test the power and volume up/down buttons themselves. |