Changes between Version 23 and Version 24 of Hardware/hNodes/cNodeVer3/dAssembly


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Timestamp:
06/18/13 20:16:25 (4 years ago)
Author:
ssugrim
Comment:

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  • Hardware/hNodes/cNodeVer3/dAssembly

    v23 v24  
    22[[TOC(Hardware,Hardware/hNodes*, depth=5)]] 
    33 
    4 Assembly process consist of: 
    5  
    6  * General Assembly 
    7   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/aCase Case] 
    8   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/bCM CM] 
    9  * Specific Pages 
    10   * LV-678 
    11   * LV-67B 
    12   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/aLV67C LV-67C] 
    13   * LV-67F 
    14   * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/aaLV67G LV-67G] 
    15  
    16 * [wiki:Hardware/hNodes/cNodeVer3/dAssembly/4MobNode 4 Node Group] 
     4A fully functional test bed requires several nodes. To assemble the node has 3 major components (and 1 optional): 
     5 1. Case 
     6 1. CM 
     7 1. Mother board bios 
     8 1. Wifi/Wimax cards and other peripherals